发明授权
- 专利标题: Method of soldering Ti containing alloys
- 专利标题(中): 焊接含Ti合金的方法
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申请号: US10021528申请日: 2001-12-10
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公开(公告)号: US06602228B2公开(公告)日: 2003-08-05
- 发明人: Leonard Nanis , Robert M. Abrams , Randy S. Chan , Janet Walsh Burpee , Clifford Teoh
- 申请人: Leonard Nanis , Robert M. Abrams , Randy S. Chan , Janet Walsh Burpee , Clifford Teoh
- 主分类号: A61M5178
- IPC分类号: A61M5178
摘要:
An improved guidewire for advancing a catheter within a body lumen which has a high strength proximal portion, a distal portion formed of superelastic alloy and a connector formed of superelastic alloy to provide torque transmitting coupling between the distal end of the proximal portion and the proximal end of the distal portion. The superelastic alloy elements are preferably cold worked and then heat treated at a temperature well above the austenite-to-martensite transformation temperature, while being subjected to longitudinal stresses equal to about 5 to about 50% of the room temperature yield stress to impart to the metal a straight “memory.” The guiding member using such improved material exhibits a stress induced austenite-to-martensite phase transformation at an exceptionally high constant yield strength of at least 70 ksi for solid members and at least 50 ksi for tubular members with a broad recoverable strain of at least about 4% during the phase transformation.
公开/授权文献
- US20020087099A1 Method of soldering Ti containing alloys 公开/授权日:2002-07-04
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