Invention Grant
US06606335B1 Semiconductor laser, semiconductor device, and their manufacture methods 有权
半导体激光器,半导体器件及其制造方法

  • Patent Title: Semiconductor laser, semiconductor device, and their manufacture methods
  • Patent Title (中): 半导体激光器,半导体器件及其制造方法
  • Application No.: US09743636
    Application Date: 2001-01-12
  • Publication No.: US06606335B1
    Publication Date: 2003-08-12
  • Inventor: Akito KuramataKazuhiko Horino
  • Applicant: Akito KuramataKazuhiko Horino
  • Priority: JP10-198512 19980714; JP10-355683 19981215
  • Main IPC: H01S500
  • IPC: H01S500
Semiconductor laser, semiconductor device, and their manufacture methods
Abstract:
A substrate is made of SiC. A plurality of AlxGa1−xN patterns (0≦x≦1) is formed on a surface of the substrate and dispersively distributed in an in-plane of the substrate. An AlyGa1−yN buffer layer (0≦y≦1) covers the surface of the substrate and the AlxGa1−xN patterns. A laser structure is formed on the AlyGa1−yN buffer layer. Since the AlGaN buffer layer is grown by using the AlGaN patterns as seed crystals, a dislocation density of a predetermined region in the AlGaN buffer layer can be lowered. The characteristics of a laser structure can be improved by forming the laser structure above the region having a low dislocation density. Since the AlGaN pattern has electric conductivity, the device resistance can be suppressed from being increased.
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