发明授权
US06607993B1 Method using ultraviolet radiation for integrated circuit manufacturing
有权
使用紫外线辐射进行集成电路制造的方法
- 专利标题: Method using ultraviolet radiation for integrated circuit manufacturing
- 专利标题(中): 使用紫外线辐射进行集成电路制造的方法
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申请号: US10224061申请日: 2002-08-19
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公开(公告)号: US06607993B1公开(公告)日: 2003-08-19
- 发明人: Ronald Dickinson , Yeow Meng Teo , Dong Xiang Qi , Rajan Rajgopal
- 申请人: Ronald Dickinson , Yeow Meng Teo , Dong Xiang Qi , Rajan Rajgopal
- 主分类号: H01L214763
- IPC分类号: H01L214763
摘要:
A method is provided for manufacturing an integrated circuit including a substrate with a gate layer and a gate dielectric provided on the substrate. The gate layer is formed into a gate using a process that imposes a charge in the gate dielectric. The substrate, gate, and gate dielectric are irradiated to discharge the charge across the gate dielectric.
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