An electronic lapping guide (ELG) and method of making are provided for precisely lapping a read sensor to a designed air bearing surface (ABS). In the method a sensor material layer is formed on a wafer after which a portion of the sensor material layer is removed and ELG material is deposited therein. This is followed by forming track widths and back edges for each of the ELG and the read sensor to be followed by lapping to the ABS. Various films are employed for the ELG to minimize magnetoresistance and optimize the resistance of the ELG. The resistance of the ELG is then sensed by a computer for controlling a lapping tool to lap to the aforementioned ABS.