- 专利标题: Method of holding substrate and substrate holding system
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申请号: US10107353申请日: 2002-03-28
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公开(公告)号: US06610171B2公开(公告)日: 2003-08-26
- 发明人: Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
- 申请人: Naoyuki Tamura , Kazue Takahashi , Youichi Ito , Yoshifumi Ogawa , Hiroyuki Shichida , Tsunehiko Tsubone
- 优先权: JP5-230187 19930916; JP6-48286 19940318
- 主分类号: H05H100
- IPC分类号: H05H100
摘要:
A method and system of holding a substrate where foreign substances on the back surface can be decreased. The substrate holding system comprises a ring-shaped leakage-proof surface having a smooth surface on the specimen table corresponding to the periphery of the substrate, a plurality of contact holding portions within the periphery of the substrate, and electrostatic attraction means for fixing the substrate by contacting the back surface of the substrate to the ring-shaped leakage-proof surface and the contact holding portions. The substrate contacts to the cooling surface at the ring-shaped leakage-proof surface and the contact holding portion placed on a position inside the ring-shaped leakage-proof surface. The back surface of the substrate and the cooling surface do not contact to each other in the large portion of the remaining area.
公开/授权文献
- US20020104618A1 Method of holding substrate and substrate holding system 公开/授权日:2002-08-08
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