• 专利标题: Glass-ceramic composition for ceramic electronic part, ceramic electronic part, and method for manufacturing multilayer ceramic electronic part
  • 申请号: US09996547
    申请日: 2001-11-28
  • 公开(公告)号: US06610621B2
    公开(公告)日: 2003-08-26
  • 发明人: Kenji Masuko
  • 申请人: Kenji Masuko
  • 优先权: JP2000-362079 20001129; JP2001-275084 20010911
  • 主分类号: C03C1400
  • IPC分类号: C03C1400
Glass-ceramic composition for ceramic electronic part, ceramic electronic part, and method for manufacturing multilayer ceramic electronic part
摘要:
When ceramic electronic parts such as multilayer ceramic substrates that have a substrate body and metal wiring conductors comprising silver are manufactured, a composition comprising not only a borosilicate glass powder and a ceramic powder, but also an additive powder comprising at least one of cerium oxide, bismuth, bismuth oxide, antimony and antimony oxide is used as a composition for preparing the substrate body. Gray discoloration of the substrate body and yellow discoloration in the vicinities of the metal wiring conductors can be prevented.
信息查询
0/0