- 专利标题： Semiconductor module and method of making the device
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申请号： US09995772申请日： 2001-11-29
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公开(公告)号： US06610934B2公开(公告)日： 2003-08-26
- 发明人: Yoshihide Yamaguchi , Takao Terabayashi , Hiroyuki Tenmei , Hiroshi Hozoji , Naoya Kanda
- 申请人： Yoshihide Yamaguchi , Takao Terabayashi , Hiroyuki Tenmei , Hiroshi Hozoji , Naoya Kanda
- 优先权： JP2001-163640 20010531
- 主分类号： H01R1204
- IPC分类号： H01R1204
摘要：
A multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices in which the wiring substrate comprises a glass substrate having holes formed by sand blasting and a wiring layer formed on the surface of the glass substrate and having wiring and an insulation layer.
公开/授权文献
- US20020180027A1 Semiconductor module and method of making the device 公开/授权日：2002-12-05
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