发明授权
US06614623B2 Disc drive head supporting mechanism having power supply pads for an integrated circuit which are of a greater area than signal/control junction pads
失效
盘驱动头支撑机构具有用于集成电路的电源焊盘，其具有比信号/控制接合焊盘更大的面积
- 专利标题： Disc drive head supporting mechanism having power supply pads for an integrated circuit which are of a greater area than signal/control junction pads
- 专利标题（中）： 盘驱动头支撑机构具有用于集成电路的电源焊盘，其具有比信号/控制接合焊盘更大的面积
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申请号： US09917706申请日： 2001-07-31
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公开(公告)号： US06614623B2公开(公告)日： 2003-09-02
- 发明人: Shigeo Nakamura , Kousaku Wakatsuki , Haruhide Takahashi , Hitoshi Shindo , Hiromitsu Masuda , Mikio Tokuyama , Toshihiko Shimizu
- 申请人： Shigeo Nakamura , Kousaku Wakatsuki , Haruhide Takahashi , Hitoshi Shindo , Hiromitsu Masuda , Mikio Tokuyama , Toshihiko Shimizu
- 优先权： JP2000-247939 20000810
- 主分类号： G11B548
- IPC分类号： G11B548
摘要：
To restrain temperature rise by controlling heat radiation from an IC. More specifically, an area of junctioning pads which are in contact with an IC is enlarged to substantially overlap the whole or at least half or more of the area of the IC. Further, the IC is covered with an overcoat which protrudes to other parts of a head supporting mechanism.
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