发明授权
- 专利标题: Method and apparatus for solder splicing and grounding coaxial cables
- 专利标题(中): 焊接和接地同轴电缆的方法和设备
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申请号: US10050363申请日: 2002-01-16
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公开(公告)号: US06616463B1公开(公告)日: 2003-09-09
- 发明人: Jason Burnett , Michael C. Iannaccone , Toshitaka Tezuna
- 申请人: Jason Burnett , Michael C. Iannaccone , Toshitaka Tezuna
- 主分类号: H01R466
- IPC分类号: H01R466
摘要:
Two embodiments of a mechanism for splicing a coaxial radio cable to an antenna wire and grounding the braided outer conductor are disclosed. Both embodiments comprise an injection molded plastic box having two longitudinally spaced and independently operable snap lock covers and an insert molded metal grounding bracket which permits the device to be attached to, for example, an automobile body part. Within each box are locations for receiving an end-stripped coaxial cable and at least one end-stripped antenna wire in opposing alignment with the inner conductor of the coaxial cable so as to define a solder splice point. A soldering fork formed on the insert molded portion of the grounding bracket projects through the floor of the box into the interior thereof to serve as a solder point for the braided outer conductor of the coaxial cable. In the second embodiment an antenna grounding wire is also brought into the box and grounded to the soldering fork along with the braided inner conductor of the coaxial cable. A method comprising a sequence of cable and wire placements, cover closings and soldering steps is disclosed.
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