Invention Grant
US06623670B2 Method of molding a transparent coating member for light-emitting diodes
有权
模制用于发光二极管的透明涂层部件的方法
- Patent Title: Method of molding a transparent coating member for light-emitting diodes
- Patent Title (中): 模制用于发光二极管的透明涂层部件的方法
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Application No.: US09860427Application Date: 2001-05-21
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Publication No.: US06623670B2Publication Date: 2003-09-23
- Inventor: Masutsugu Tasaki , Akira Ichikawa , Tsutomu Odaki , Kazuhisa Takagi
- Applicant: Masutsugu Tasaki , Akira Ichikawa , Tsutomu Odaki , Kazuhisa Takagi
- Main IPC: B29C4500
- IPC: B29C4500

Abstract:
This invention relates to a method of producing a molded transparent covering member. The steps of the method comprise providing a silicon rubber material and a fluorescent substance together to form a material to be molded in a space between an inner surface of an upper mold and an outer surface of a lower mold; sand-blasting at least one of the inner surface of said upper mold and the outer surface of the lower mold; and injecting the material into the space formed between upper mold and the lower mold.
Public/Granted literature
- US20020030292A1 Transparent coating member for light-emitting diodes and a fluorescent color light source Public/Granted day:2002-03-14
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