A TTP comprising two substrates each provided with a transparent resistive-layer, and an insulating section formed on at least one of the transparent resistive-layers using an ultra violet curing resin or an electron beam curing resin. The glass transition temperature of the cured resin in the insulating section is not higher than 80° C., and the insulating section contains a methyl ethyl keton soluble component of not less than 5 weight % and not more than 80 weight %. Since the insulating section is cured at a low temperature, it may be formed on a plastic substrate whose heat-withstanding capability is low. The insulating section can be formed in any desired shape and it can be cured within a short curing time, which are quite advantageous properties for the production of TTPs in volume. The insulating section spreads only minimally during the curing operation, therefore the initial shape, if it is a fine pattern, can be well preserved. Since an acid, alkaline solution or organic solvent is not used for forming the insulating section in the present invention, TTPs thus manufactured are free from the safety problems on the production floor as well as the environmental hazards associated with the use of these chemicals. The same applies also to an electronic system that incorporates the TTP.