An optical pickup assembly includes an optical pickup unit (OPU) and a flex circuit. The OPU is mounted atop a thermally conductive plate through a cutout of the flex circuit. Bond wires couple contacts pads on the OPU and the flex circuit. Alternatively, OPU is mounted atop the plate and the plate is mounted atop the flex circuit. The plate includes a cutout where bond wires pass through to couple the contact pads on the OPU and the flex circuit.