A method and an apparatus for treating a workpiece using a plasma are disclosed in the present invention. In treating a workpiece using a plasma, the apparatus includes at least one pin electrode for receiving a power source, a dielectric body having first and second sides, wherein the first side is coupled to the pin electrode and the second side has at least one capillary extending to a direction of the first side of the dielectric body, and each capillary is substantially aligned with each pin electrode, and a counter electrode electrically coupled to the pin electrode for generating the plasma from each capillary.