发明授权
- 专利标题: Bonding system having adherence to low energy surfaces
- 专利标题(中): 粘合系统具有坚固的低能量表面
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申请号: US10094817申请日: 2002-03-12
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公开(公告)号: US06632908B1公开(公告)日: 2003-10-14
- 发明人: Eerik Maandi
- 申请人: Eerik Maandi
- 主分类号: C08F11802
- IPC分类号: C08F11802
摘要:
The present invention is directed to (meth)acrylate compositions useful for bonding substrates including metals, plastics, and glass to similar or different substrates, in particular, low energy surfaces. The invention also provides an initiator system for (meth)acrylate based adhesives; a kit for bonding substrates, at least one of which includes a low energy surface; a resultant bonded assembly; and a method of bonding low energy substrates. A (meth)acrylate composition within the present invention includes a (meth)acrylate component and an initiator system including an organometallic compound, a peroxy compound, an aziridine functionalized compound, and a compound having an acid functional group.
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