发明授权
- 专利标题: Soldering iron with heated gas flow
- 专利标题(中): 烙铁加热气流
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申请号: US10000797申请日: 2001-12-04
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公开(公告)号: US06633021B2公开(公告)日: 2003-10-14
- 发明人: Kensei Matubara
- 申请人: Kensei Matubara
- 主分类号: B23K300
- IPC分类号: B23K300
摘要:
It is an object to provide a solder iron such that in the solder iron for blowing out a heating gas flow to a periphery of a forward end tip, the heating gas flow having stable temperature is generated. A nozzle section is provided to a forward end tip heated by heating means of a solder iron main body, an orifice section is formed between a heating gas flow generating chamber and the nozzle section, and a back pressure of thermally expanded heating gas and a pressure of gas successively supplied are balanced in the heating gas flow generating chamber.
公开/授权文献
- US20020079305A1 Soldering iron 公开/授权日:2002-06-27