• 专利标题: Wiring pattern decision method considering electrical length and multi-layer wiring board
  • 申请号: US09864865
    申请日: 2001-05-23
  • 公开(公告)号: US06640332B2
    公开(公告)日: 2003-10-28
  • 发明人: Hiroyuki MitomeKatsuyuki Itoh
  • 申请人: Hiroyuki MitomeKatsuyuki Itoh
  • 优先权: JP2000-155953 20000523
  • 主分类号: G06F1750
  • IPC分类号: G06F1750
Wiring pattern decision method considering electrical length and multi-layer wiring board
摘要:
A method for determining a wiring pattern of a signal line for connection of a circuit on a multi-layer printed wiring board includes the steps of providing a constraint of an electrical length which the signal line must satisfy, determining an electrical length change at a discontinuous delay part of the signal line along which a signal propagates, determining a wiring route of the signal line, calculating an electrical length of the signal line with use of a wiring length of the signal line and the determined electrical length change, judging whether or not the calculated electrical length satisfies the electrical length constraint given to the signal line, and determining the wiring route as a wiring pattern when the electrical length constraint is satisfied as the decision result, thereby carrying out a wiring layout to make an electrical length constraint satisfied.
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