发明授权
- 专利标题： Method of manufacturing printed circuit boards
- 专利标题（中）： 制造印刷电路板的方法
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申请号： US09753849申请日： 2001-01-03
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公开(公告)号： US06641860B1公开(公告)日： 2003-11-04
- 发明人: Terrance Z. Kaiserman , Keith J. Margolin
- 申请人： Terrance Z. Kaiserman , Keith J. Margolin
- 主分类号： B05D512
- IPC分类号： B05D512
摘要：
Methods of manufacturing printed circuit boards are disclosed. The methods utilize various printing techniques to apply conductive compositions to substrates in the creation of printed circuit boards. The method of manufacturing printed circuit board comprises the step of applying conductive composition to a substrate through a cold welding process.