• 专利标题: Methodology to introduce metal and via openings
  • 申请号: US09878058
    申请日: 2001-06-07
  • 公开(公告)号: US06641982B2
    公开(公告)日: 2003-11-04
  • 发明人: Ajay Jain
  • 申请人: Ajay Jain
  • 主分类号: G03F700
  • IPC分类号: G03F700
Methodology to introduce metal and via openings
摘要:
A method including forming a photoimageable material on a substrate; developing the photoimageable material over an opening area, the photoimageable material over a first portion of the opening area developed to a first extent and the photoimageable material over a second portion of the opening area developed to a different second extent; removing developed photoimageable material from the opening area; and forming an opening in the substrate in the opening area.
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