A multi-functional memory chip connector includes an insulation frame having a memory chip insertion portion, a plurality of connecting slots on an inside surface of the memory chip insertion portion for electrically coupling a variety of memory chips, and a plurality of connector terminals extending from the connecting slots and distributed to three sides of the insulation frame for electrically coupling with a circuit board. The connector also includes a plurality of card insertion slots for receiving a plurality of memory chips with various connection specifications, and an upper lid for mounting on the top of the insulation frame.