- 专利标题: Method and apparatus for controlling CMP pad surface finish
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申请号: US10039749申请日: 2001-10-26
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公开(公告)号: US06645052B2公开(公告)日: 2003-11-11
- 发明人: Alan J. Jensen , Mario Stella , Eugene Zhao , Peter Renteln , Jeffrey Farber
- 申请人: Alan J. Jensen , Mario Stella , Eugene Zhao , Peter Renteln , Jeffrey Farber
- 主分类号: B24B100
- IPC分类号: B24B100
摘要:
A method and apparatus for pre-conditioning a polishing pad for use in chemical mechanical planarization of semiconductor wafers is described. The apparatus includes a pre-conditioning member having a smooth surface. The method includes providing a pre-conditioning member having a smooth surface, pressing the pre-conditioning member against the polishing pad while moving the polishing pad, and flattening the surface of the polishing pad until a polishing pad flatness is achieved that may be used to achieve a desired semiconductor wafer planarity.