Invention Grant
- Patent Title: Enhanced electronic card structure
- Patent Title (中): 增强电子卡结构
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Application No.: US10357223Application Date: 2003-02-04
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Publication No.: US06646885B1Publication Date: 2003-11-11
- Inventor: Gordon Yu , Tsung-Kan Cheng , Forli Wen
- Applicant: Gordon Yu , Tsung-Kan Cheng , Forli Wen
- Priority: TW91215697U 20021003
- Main IPC: H05K502
- IPC: H05K502

Abstract:
An enhanced electronic card structure includes a circuit board, a top cover board, and a bottom cover board. The circuit board has multiple front front and rear contact points. At least one fixing hole is defined between any two adjacent front contact points. The top cover board has a front edge defined therein multiple gaps, each aligned with one front contact point and corresponding rear contact point. Any two adjacent gaps are separated by a rib, each rib having a bottom face extended thereform a fixing tip aligned with the fixing hole. The bottom cover board has a surface formed thereon multiple fixing joints, each aligned with one fixing tip at the bottom of the rib, so as to make the fixing tip pass through the corresponding fixing hole to be fixed to the corresponding fixing joint.
Information query