Invention Grant
- Patent Title: Heat-dissipating module
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Application No.: US10143303Application Date: 2002-05-09
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Publication No.: US06648065B2Publication Date: 2003-11-18
- Inventor: Wen-Shi Huang , Kuo-Cheng Lin , Tsu-Liang Lin , Tsung-Yu Lei
- Applicant: Wen-Shi Huang , Kuo-Cheng Lin , Tsu-Liang Lin , Tsung-Yu Lei
- Priority: TW90208104U 20010518
- Main IPC: H05K720
- IPC: H05K720

Abstract:
A heat-dissipating module includes a heat sink and a fan device. The fan device may be disposed on the heat sink, or inserted into the heat sink to reduce the height. The fan device includes a first rotor blade and a second rotor blade. The first rotor blade and the second rotor blade are connected in series. The rotation speed of the first rotor blade is controlled by a first control circuit, and the second rotor blade is controlled by the second circuit. Thus, the second control circuit increases the rotation speed of the second rotor blades when the first rotor blades is failed.
Public/Granted literature
- US20020170703A1 Heat-dissipating module Public/Granted day:2002-11-21
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