发明授权
- 专利标题: System for removal of photoresist using sparger
- 专利标题(中): 使用喷射器去除光刻胶的系统
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申请号: US10052823申请日: 2002-01-17
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公开(公告)号: US06649018B2公开(公告)日: 2003-11-18
- 发明人: Richard Novak , Ismail Kashkoush
- 申请人: Richard Novak , Ismail Kashkoush
- 主分类号: H01L21304
- IPC分类号: H01L21304
摘要:
A process and system for removing photoresist from semiconductor wafers comprises applying pressure in excess of one atmosphere to ozone, mixing the ozone with ambient temperature or higher deionized water via a sparger plate, and exposing the semiconductor wafers to the mixture of ozone and deionized water. The system is comprised of a tank capable of holding the semiconductor wafers, a sparger plate within the tank, a source of ozone connected to the tank, a source of deionized water connected to the tank; and finally a means for recirculating the deionized water connected to the tank. No chiller is included in the system as required by the prior art.
公开/授权文献
- US20030134518A1 System for removal of photoresist using sparger 公开/授权日:2003-07-17