Invention Grant
- Patent Title: Ingate arrangement for an injection mold
- Patent Title (中): 注塑模具的配置
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Application No.: US10036379Application Date: 2002-01-07
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Publication No.: US06652263B2Publication Date: 2003-11-25
- Inventor: Lars Persson
- Applicant: Lars Persson
- Priority: SE0103382 20011010
- Main IPC: B29C4540
- IPC: B29C4540

Abstract:
A mold includes a first and a second mutually joinable mold half which in their joined state define at least one cavity, and a sprue formed in the mold for conducting a melt to each cavity. The sprue includes an ingate portion connecting to each cavity and contained in a first ejector of an ejector arrangement. An injection molding assembly including such a mold is also disclosed.
Public/Granted literature
- US20030068403A1 Ingate arrangement Public/Granted day:2003-04-10
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