发明授权
- 专利标题: Process for the production of electric part
- 专利标题(中): 电器零件生产工艺
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申请号: US10093603申请日: 2002-03-11
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公开(公告)号: US06653207B2公开(公告)日: 2003-11-25
- 发明人: Kazuyuki Ohya , Kazuhiro Otsu , Takeshi Nobukuni
- 申请人: Kazuyuki Ohya , Kazuhiro Otsu , Takeshi Nobukuni
- 优先权: JP2001/069684 20010313
- 主分类号: H01L2130
- IPC分类号: H01L2130
摘要:
A process for the production of an electric part, comprising performing a circuit-parts-forming step including the introduction of impurities on one surface (surface A) of a semiconductor substrate, then bonding the surface A to a holding substrate, performing a back surface treatment step essentially including a polishing of an exposed surface (surface B) of the semiconductor substrate to a thickness of 100 &mgr;m or less to obtain an electric-part-formed thinned substrate and separating the thinned substrate from the holding substrate, wherein a resin composition containing a swelling inorganic compound (WC) is used for an adhesion layer and in the separating step the thinned substrate is separated from the holding substrate after decreasing the adhesive strength of the thinned substrate and the holding substrate by swelling the swelling inorganic compound (WC).
公开/授权文献
- US20020132447A1 Process for the production of electric part 公开/授权日:2002-09-19