发明授权
US06656275B2 Partial plating system 失效
部分电镀系统

  • 专利标题: Partial plating system
  • 专利标题(中): 部分电镀系统
  • 申请号: US09841224
    申请日: 2001-04-24
  • 公开(公告)号: US06656275B2
    公开(公告)日: 2003-12-02
  • 发明人: Shigeki Iwamoto
  • 申请人: Shigeki Iwamoto
  • 优先权: JP2000-128375 20000427
  • 主分类号: B05B1504
  • IPC分类号: B05B1504
Partial plating system
摘要:
A partial plating system able to gold plate only inner leads of a TAB frame, provided with a mask having an opening formed to correspond to a plating region of a TAB frame and provided horizontally; an elevating means for lowering the TAB frames toward the mask; and a pressing means for pressing the TAB frame on to the mask; a plating solution being sprayed from below the openings toward the openings to plate the plating region.
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