发明授权
- 专利标题: Partial plating system
- 专利标题(中): 部分电镀系统
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申请号: US09841224申请日: 2001-04-24
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公开(公告)号: US06656275B2公开(公告)日: 2003-12-02
- 发明人: Shigeki Iwamoto
- 申请人: Shigeki Iwamoto
- 优先权: JP2000-128375 20000427
- 主分类号: B05B1504
- IPC分类号: B05B1504
摘要:
A partial plating system able to gold plate only inner leads of a TAB frame, provided with a mask having an opening formed to correspond to a plating region of a TAB frame and provided horizontally; an elevating means for lowering the TAB frames toward the mask; and a pressing means for pressing the TAB frame on to the mask; a plating solution being sprayed from below the openings toward the openings to plate the plating region.
公开/授权文献
- US20010036514A1 Partial plating system 公开/授权日:2001-11-01
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