Embodiments provide a method, article of manufacture, and apparatus for providing a component package for components such as integrated circuits. In one embodiment, a carrier includes a plurality of sidewalls formed thereon to form a component package assembly. In one aspect, a cover is bonded to the component package assembly to form a plurality of separable individual component packages having a cavity therein, where each individual component package encapsulates at least one component disposed on the carrier. The component package assembly is then separated into individually packaged devices.