Invention Grant
- Patent Title: Light emitting diode package structure having an electro-static protective diode
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Application No.: US10179212Application Date: 2002-06-26
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Publication No.: US06661032B2Publication Date: 2003-12-09
- Inventor: Hsiang-Chih Meng , Li-Ching Ma , Chi-Ming Lin
- Applicant: Hsiang-Chih Meng , Li-Ching Ma , Chi-Ming Lin
- Priority: TW90223502U 20011228
- Main IPC: H01L3300
- IPC: H01L3300

Abstract:
A LED package structure having an electro-static protective diode, the structure is disclosed. The structure comprises: an electro-static protective diode having an n-type electrode mounted on a lampstand by a conductive paste layer, so that it forms an electrical connecting with a positive leadfame. A LED having a p-type and an n-type electrode positioned on one side and a bottom on the other side of the LED mounted by an insulating layer atop the p-type electrode of the electro-static protective diode. Next a first conductive wire connects between the p-type electrode of the LED and the positive leadframe. A second conductive wire, connects the n-type electrode of the LED with the negative leadframe. A third conductive wire connects the p-type electrode of the electro-static protection diode to the negative electrode of the leadframe. Transparent resin is finally used to form a dome-shaped package.
Public/Granted literature
- US20030122139A1 Light emitting diode package structure having an electro-static protective diode Public/Granted day:2003-07-03
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