发明授权
US06664154B1 Method of using amorphous carbon film as a sacrificial layer in replacement gate integration processes 有权
在替代栅极集成工艺中使用无定形碳膜作为牺牲层的方法

Method of using amorphous carbon film as a sacrificial layer in replacement gate integration processes
摘要:
An exemplary embodiment relates to a method of using amorphous carbon in replacement gate integration processes. The method can include depositing an amorphous carbon layer above a substrate, patterning the amorphous carbon layer, depositing a dielectric layer over the patterned amorphous carbon layer, removing a portion of the deposited dielectric layer to expose a top of the patterned amorphous carbon layer, removing the patterned amorphous carbon layer leaving an aperture in the dielectric layer, and forming a metal gate in the aperture of the dielectric layer.
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