发明授权
- 专利标题： Thermally enhanced lid for multichip modules
- 专利标题（中）： 多芯片模块的热增强盖
-
申请号： US10198393申请日： 2002-07-16
-
公开(公告)号： US06665187B1公开(公告)日： 2003-12-16
- 发明人: David J. Alcoe , William L. Brodsky , Varaprasad V. Calmidi , Sanjeev B. Sathe , Randall J. Stutzman
- 申请人： David J. Alcoe , William L. Brodsky , Varaprasad V. Calmidi , Sanjeev B. Sathe , Randall J. Stutzman
- 主分类号： H05K720
- IPC分类号： H05K720
摘要：
An electronic package having one or more components comprising: a substrate having a first coefficient of thermal expansion; a lid attached to the substrate, the lid including a vapor chamber, the lid having a second coefficient of thermal expansion, the first coefficient of thermal expansion matched to the second coefficient of expansion; a thermal transfer medium in contact with a back surface of each component and an outer surface of a lower wall of the lid; and each component electrically connected to a top surface of the substrate.
信息查询
