- 专利标题: Spacer-connector stud for stacked surface laminated multi-chip modules and methods of manufacture
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申请号: US10301196申请日: 2002-11-21
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公开(公告)号: US06667555B2公开(公告)日: 2003-12-23
- 发明人: David Leslie Cohn , Dennis Jay McBride , Robert Kevin Montoye
- 申请人: David Leslie Cohn , Dennis Jay McBride , Robert Kevin Montoye
- 主分类号: H01L2348
- IPC分类号: H01L2348
摘要:
A spacer-connector stud comprises a stacked array of glass epoxy laminates, each laminate having a copper layer laminated thereto. The top and bottom laminates of the stud include a spatial array of thermal contacts suitable as a footprint for C4 bump technology. A location is selected on a circuitized base card to accommodate the laminated stud. The stud has a thickness greater than twice the thickness of the components attached to the card. The thermal contacts on the stud, typically solderable, join to a wiring array on the card. A second multi-chip module card having attached and interconnected components on both sides of the second card is mechanically aligned with the based card and pressed against the contacts on the top layer of the stud to form an assembly. The assembly is heated causing the second card to become soldered to the contact footprint on the stud.