A ball grid array module is provided. In particular, the ball grid array module includes a substrate with two layers of insulation positioned thereon. At least one cavity having a side wall and a bottom wall is positioned in the first and second layers of insulation. The ball grid array module is adapted for having a solder ball positioned on the bottom wall of the cavity. During heating and reflow of the solder ball, positioning of the solder ball in the cavity prevents dislodging of the solder ball.