发明授权
- 专利标题： Printed wiring board, and method and apparatus for manufacturing the same
- 专利标题（中）： 印刷电路板及其制造方法和装置
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申请号： US09975780申请日： 2001-10-12
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公开(公告)号： US06671951B2公开(公告)日： 2004-01-06
- 发明人: Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hidenori Hayashi , Toru Fujimoto , Toshiharu Okada , Izuru Nakai
- 申请人： Toshihiro Nishii , Shigeru Yamane , Shinji Nakamura , Hidenori Hayashi , Toru Fujimoto , Toshiharu Okada , Izuru Nakai
- 主分类号： H01R2368
- IPC分类号： H01R2368
摘要：
In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.
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