发明授权
- 专利标题: Polishing composition and polishing method employing it
- 专利标题(中): 抛光组合物和抛光方法
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申请号: US10046394申请日: 2002-01-16
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公开(公告)号: US06679929B2公开(公告)日: 2004-01-20
- 发明人: Hiroshi Asano , Kenji Sakai , Katsuyoshi Ina
- 申请人: Hiroshi Asano , Kenji Sakai , Katsuyoshi Ina
- 优先权: JP2001-023316 20010131
- 主分类号: C09G102
- IPC分类号: C09G102
摘要:
A polishing composition comprising the following components (a) to (g): (a) at least one abrasive selected from the group consisting of silicon dioxide, aluminum oxide, cerium oxide, zirconium oxide and titanium oxide, (b) an aliphatic carboxylic acid, (c) at least one basic compound selected from the group consisting of an ammonium salt, an alkali metal salt, an alkaline earth metal salt, an organic amine compound and a quaternary ammonium salt, (d) at least one polishing accelerating compound selected from the group consisting of citric acid, oxalic acid, tartaric acid, glycine, &agr;-alanine and histidine, (e) at least one anticorrosive selected from the group consisting of benzotriazole, benzimidazole, triazole, imidazole and tolyltriazole, (f) hydrogen peroxide, and (g) water.
公开/授权文献
- US20020139055A1 Polishing composition and polishing method employing it 公开/授权日:2002-10-03
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