发明授权
- 专利标题： Electronic device and method of fabricating the same
- 专利标题（中）： 电子装置及其制造方法
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申请号： US09628756申请日： 2000-07-31
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公开(公告)号： US06680435B1公开(公告)日： 2004-01-20
- 发明人: Toshio Ogawa , Masaaki Takahashi , Noritaka Kamimura , Kazuji Yamada , Toshiaki Kaminaga
- 申请人： Toshio Ogawa , Masaaki Takahashi , Noritaka Kamimura , Kazuji Yamada , Toshiaki Kaminaga
- 优先权： JP11-220785 19990804
- 主分类号： H01L2328
- IPC分类号： H01L2328
摘要：
An electronic device has a wiring board mounted with an electronic circuit chip. A recess or through-hole is formed in a major surface of the wiring board on which the electronic circuit chip is mounted at a position corresponding to a central portion of the electronic circuit chip. Air trapped in a space between the electronic circuit chip and the wiring board is collected in the recess or through-hole to form a void separated from the electronic circuit chip.
信息查询
