发明授权
US06688784B1 Parallel plate development with multiple holes in top plate for control of developer flow and pressure
有权
平行板开发,顶板上有多个孔,用于控制显影剂的流动和压力
- 专利标题: Parallel plate development with multiple holes in top plate for control of developer flow and pressure
- 专利标题(中): 平行板开发,顶板上有多个孔,用于控制显影剂的流动和压力
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申请号: US09974620申请日: 2001-10-10
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公开(公告)号: US06688784B1公开(公告)日: 2004-02-10
- 发明人: Michael K. Templeton
- 申请人: Michael K. Templeton
- 主分类号: G03D504
- IPC分类号: G03D504
摘要:
A system and method is provided for applying a developer to a photoresist material layer disposed on a semiconductor substrate. The developer system and method employ a developer plate having a plurality of a application apertures for dispensing developer and a plurality of exit apertures for allowing excess developer to be removed from between the developer plate and the photoresist material layer. Preferably, the developer plate has a bottom surface with a shape that is similar to the wafer. The developer plate is disposed above the wafer and substantially and/or completely surrounds the top surface of the wafer during application of the developer. A small gap is formed between the wafer and the bottom surface of the developer plate. The wafer and the developer plate form a parallel plate pair, such that the gap can be made small enough so that the developer fluid quickly fills the gap with excess developer exiting through the exit apertures.
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