发明授权
US06688784B1 Parallel plate development with multiple holes in top plate for control of developer flow and pressure 有权
平行板开发,顶板上有多个孔,用于控制显影剂的流动和压力

  • 专利标题: Parallel plate development with multiple holes in top plate for control of developer flow and pressure
  • 专利标题(中): 平行板开发,顶板上有多个孔,用于控制显影剂的流动和压力
  • 申请号: US09974620
    申请日: 2001-10-10
  • 公开(公告)号: US06688784B1
    公开(公告)日: 2004-02-10
  • 发明人: Michael K. Templeton
  • 申请人: Michael K. Templeton
  • 主分类号: G03D504
  • IPC分类号: G03D504
Parallel plate development with multiple holes in top plate for control of developer flow and pressure
摘要:
A system and method is provided for applying a developer to a photoresist material layer disposed on a semiconductor substrate. The developer system and method employ a developer plate having a plurality of a application apertures for dispensing developer and a plurality of exit apertures for allowing excess developer to be removed from between the developer plate and the photoresist material layer. Preferably, the developer plate has a bottom surface with a shape that is similar to the wafer. The developer plate is disposed above the wafer and substantially and/or completely surrounds the top surface of the wafer during application of the developer. A small gap is formed between the wafer and the bottom surface of the developer plate. The wafer and the developer plate form a parallel plate pair, such that the gap can be made small enough so that the developer fluid quickly fills the gap with excess developer exiting through the exit apertures.
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