A method of encapsulating components based on organic semiconductors, includes adhesively bonding a housing to a substrate. Bonding is carried out using a UV-curable reactive adhesive including an epoxy resin, a hydroxy-functional reaction product of an epoxide compound with a phenolic compound, a silane-type adhesion promoter, and a photoinitiator, and also if desired, filler. This method is used in particular for encapsulating organic light-emitting diodes (OLEDs).