发明授权
- 专利标题: In situ molded thermal barriers
- 专利标题(中): 原位模制热障
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申请号: US09999307申请日: 2001-10-31
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公开(公告)号: US06698146B2公开(公告)日: 2004-03-02
- 发明人: Michael D. Morgan , Xiudong Sun , Laura A. Tennenhouse , Robert A. Wiercinski , Benita Dair , Antonio J. Aldykiewicz, Jr. , Leon Bablouzian , Lawrence Shapiro
- 申请人: Michael D. Morgan , Xiudong Sun , Laura A. Tennenhouse , Robert A. Wiercinski , Benita Dair , Antonio J. Aldykiewicz, Jr. , Leon Bablouzian , Lawrence Shapiro
- 主分类号: E04C200
- IPC分类号: E04C200
摘要:
The invention provides methods, systems, and devices for installing thermal barriers in openings or gaps in or between structures such as walls, ceilings, and floors. At least one thermal barrier molding bag is positioned in the hole or gap, and a flowable firestop material that is operative to cure or harden, such as a hydratable cementitious slurry, is introduced into the bag to mold a barrier in the hole or gap.
公开/授权文献
- US20030079425A1 In situ molded thermal barriers 公开/授权日:2003-05-01
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