发明授权
- 专利标题： Injection molding apparatus
- 专利标题（中）： 注塑设备
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申请号： US10417093申请日： 2003-04-17
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公开(公告)号： US06699026B2公开(公告)日： 2004-03-02
- 发明人: Tatsuhiko Maru , Jun Koike , Katsumi Watanabe , Fumiyuki Katoh , Makoto Nishizawa , Hajime Kitamura
- 申请人： Tatsuhiko Maru , Jun Koike , Katsumi Watanabe , Fumiyuki Katoh , Makoto Nishizawa , Hajime Kitamura
- 优先权： JP2002-116175 20020418; JP2002-116176 20020418; JP2002-116177 20020418; JP2002-116178 20020418; JP2002-116179 20020418; JP2002-116180 20020418; JP2003-075129 20030319; JP2003-075130 20030319; JP2003-075131 20030319; JP2003-075132 20030319; JP2003-075133 20030319; JP2003-075134 20030319
- 主分类号： B29C4578
- IPC分类号： B29C4578
摘要：
An injection molding apparatus comprises a cell assembly that has a tiered frame. The tiered frame is provided with lower unit storage sections and upper unit storage sections. The lower unit storage sections are provided with holders, individually, and injection molding machine units are mounted on the holders, individually. The upper unit storage sections are provided with holders, individually, and injection molding machine units are mounted on the holders, individually. Material supply pipes, temperature control piping, etc. of the injection molding machine units are arranged in a layout space on the side of a back portion of the cell assembly.
公开/授权文献
- US20030198701A1 INJECTION MOLDING APPARATUS 公开/授权日：2003-10-23