发明授权
- 专利标题： Device and method for the treatment of semiconductor wafers
- 专利标题（中）： 用于处理半导体晶片的装置和方法
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申请号： US10258559申请日： 2002-10-23
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公开(公告)号： US06706121B2公开(公告)日： 2004-03-16
- 发明人: Manfred Schenkl , Robert Pesce , John Oshinowo , Uwe Müller
- 申请人： Manfred Schenkl , Robert Pesce , John Oshinowo , Uwe Müller
- 优先权： DE10020185 20000425
- 主分类号： C23G102
- IPC分类号： C23G102
摘要：
In a method of treating substrates a treatment fluid is fed into a collection vessel after treatment, at least a portion of the treatment fluid is withdrawn from the collection vessel and returned to respective reservoir and the collection vessel is rinsed before receiving another treatment fluid.
公开/授权文献
- US20030098043A1 Device and method for treating semiconductor wafers 公开/授权日：2003-05-29