发明授权
- 专利标题： Semiconductor device-socket
- 专利标题（中）： 半导体器件插座
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申请号： US10180012申请日： 2002-06-26
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公开(公告)号： US06707309B2公开(公告)日： 2004-03-16
- 发明人: Masaru Sato , Hiroyuki Kitada
- 申请人： Masaru Sato , Hiroyuki Kitada
- 优先权： JP2001-195417 20010627
- 主分类号： G01R3102
- IPC分类号： G01R3102
摘要：
An accommodation portion for a semiconductor device to be mounted is formed of an accommodation portion of a positioning member that is restricted in its position to a socket body and supported on the same, and an accommodation portion of a positioning member that is supported on the socket body relatively movably with respect to the socket body.
公开/授权文献
- US20030001600A1 Semiconductor device-socket 公开/授权日：2003-01-02
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