发明授权
- 专利标题： Angled flying lead wire bonding process
- 专利标题（中）： 垂直引线接合工艺
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申请号： US10342167申请日： 2003-01-14
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公开(公告)号： US06708403B2公开(公告)日： 2004-03-23
- 发明人: Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Da-Yuan Shih
- 申请人： Brian Samuel Beaman , Keith Edward Fogel , Paul Alfred Lauro , Da-Yuan Shih
- 主分类号： H01R900
- IPC分类号： H01R900
摘要：
A method is described having the steps of providing a surface having a plurality of wire bondable locations; wire bonding a wire to each of the wire bondable locations using a wire capillary tool; controlling the position of the capillary tool with respect to the substrate; after forming a wire bond of the wire to the wire bondable location moving the capillary tool relative to the surface as the capillary tool is moved away from the surface to form a wire having a predetermined shape.
公开/授权文献
- US20030106213A1 Angled flying lead wire bonding process 公开/授权日：2003-06-12
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