发明授权
- 专利标题： Cover tape for electronic part conveyance and electronic part conveying member
- 专利标题（中）： 电子部件输送用盖带和电子部件输送部件
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申请号： US09892859申请日： 2001-06-28
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公开(公告)号： US06709702B2公开(公告)日： 2004-03-23
- 发明人: Ichiro Nakano , Hiroki Ichikawa , Seiji Izutani
- 申请人： Ichiro Nakano , Hiroki Ichikawa , Seiji Izutani
- 优先权： JP2000-194470 20000628
- 主分类号： B32B1508
- IPC分类号： B32B1508
摘要：
A cover tape for the electronic-part conveyance comprises at least four laminated layers of: a substrate; at least one layer of a base coating layer and an intermediate layer, provided on the substrate; an adhesive layer, provided on the at least one layer of the coating layer and the intermediate layer; and a conductive layer formed on at least one of the rear surface of the substrate and the front surface of the adhesive layer by deposition.
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