发明授权
- 专利标题: Method of manufacturing composite array structure
- 专利标题(中): 复合阵列结构的制造方法
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申请号: US10288673申请日: 2002-11-05
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公开(公告)号: US06711807B2公开(公告)日: 2004-03-30
- 发明人: Anil Raj Duggal , Minyoung Lee , Lionel Monty Levinson
- 申请人: Anil Raj Duggal , Minyoung Lee , Lionel Monty Levinson
- 主分类号: H01C1702
- IPC分类号: H01C1702
摘要:
The present invention provides a method of manufacturing a composite array structure that comprises a plurality of elements of an electrically conductive composite material interconnected by at least one region of an electrically insulating material. The method comprises forming regions of the electrically insulating material around regions of the electrically conductive material such that at least a surface of the regions of the electrically insulating material is below a surface of the regions of the electrically conductive material.
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