发明授权
US06713581B2 Crosslinkable polymer material of low relative permittivity, and films, substrates and electronic units formed of it
失效
低相对介电常数的交联聚合物材料，以及由其形成的薄膜，基材和电子单元
- 专利标题： Crosslinkable polymer material of low relative permittivity, and films, substrates and electronic units formed of it
- 专利标题（中）： 低相对介电常数的交联聚合物材料，以及由其形成的薄膜，基材和电子单元
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申请号： US10056119申请日： 2002-01-24
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公开(公告)号： US06713581B2公开(公告)日： 2004-03-30
- 发明人: Shigeru Asami , Toshiaki Yamada , Teruaki Sugahara , Hiroshi Hotta
- 申请人： Shigeru Asami , Toshiaki Yamada , Teruaki Sugahara , Hiroshi Hotta
- 优先权： JP2001-16364 20010124
- 主分类号： C08F22400
- IPC分类号： C08F22400
摘要：
Disclosed is a polymer material of low relative permittivity obtained through copolymerization of a monomer composition that contains, as monomers, a fumaric diester and an epoxy group-having (meth)acrylate. The polymer material bonds or adheres well to metal conductor layers, and, after crosslinked, it is patternable. In addition, it has good electric properties of low relative permittivity, low dielectric loss tangent and good electric insulation, and has good heat resistance.