发明授权
- 专利标题： Resin sealing apparatus and resin sealing method
- 专利标题（中）： 树脂密封装置和树脂密封方法
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申请号： US10091303申请日： 2002-03-06
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公开(公告)号： US06713882B2公开(公告)日： 2004-03-30
- 发明人: Naoya Yasuda
- 申请人： Naoya Yasuda
- 优先权： JP2001-287396 20010920
- 主分类号： H01L2328
- IPC分类号： H01L2328
摘要：
The resin sealing apparatus includes a mold that has a main cavity into which a portion of a semiconductor device to be sealed with a resin is disposed. Furthermore, an external-shape regulating member is detachably accommodated in the main cavity of the mold to form a new cavity inside the main cavity.
公开/授权文献
- US20030052418A1 Resin sealing apparatus and resin sealing method 公开/授权日：2003-03-20
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