An apparatus for mounting a wire component on a substrate has a feed device for feeding a wire a predetermined length intermittently, and an insert device for cutting the wire fed out by the feed device, bending the cut wire to form a wire component, rotating and positioning the wire component, and then inserting the wire component in a hole defined in the substrate. In particular, irrespective of a position of the insert device, the feed device feeds out the wire in a direction where no interference would occur between the feed device and the insert device.