发明授权
- 专利标题： Processing apparatus and processing system
- 专利标题（中）： 处理装置和处理系统
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申请号： US09846660申请日： 2001-05-01
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公开(公告)号： US06716329B2公开(公告)日： 2004-04-06
- 发明人: Wataru Okase , Takenobu Matsuo
- 申请人： Wataru Okase , Takenobu Matsuo
- 优先权： JP2000-133454 20000502; JP2000-135207 20000508; JP2000-135227 20000508
- 主分类号： C25D2112
- IPC分类号： C25D2112
摘要：
A plating system is composed of a transfer device for performing transfer of a wafer, a plating unit and a washing/drying unit provided around the transfer device. Each unit is structured to be detachable from the plating system. The plating unit is divided into a wafer transfer section and a plating section by a separator, and atmosphere of each section is independently set.
公开/授权文献
- US20010040098A1 Processing apparatus and processing system 公开/授权日：2001-11-15
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