Invention Grant
- Patent Title: Circuit board and a method for making the same
- Patent Title (中): 电路板及其制作方法
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Application No.: US10198341Application Date: 2002-07-18
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Publication No.: US06717067B2Publication Date: 2004-04-06
- Inventor: Zhong-You Shi , Delin Li , Richard McMillan
- Applicant: Zhong-You Shi , Delin Li , Richard McMillan
- Main IPC: H01R1204
- IPC: H01R1204
Abstract:
A method 10, 110 for making multi-layer circuit boards having metallized apertures 38, 40, 130, 132 which may be selectively and electrically grounded and having at least one formed air-bridge 92, 178.
Public/Granted literature
- US20030034174A1 Circuit board and a method for making the same Public/Granted day:2003-02-20
Information query
