Invention Grant
- Patent Title: Semiconductor inductor and methods for making the same
- Patent Title (中): 半导体电感及其制作方法
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Application No.: US10406914Application Date: 2003-04-02
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Publication No.: US06717232B2Publication Date: 2004-04-06
- Inventor: Subhas Bothra
- Applicant: Subhas Bothra
- Main IPC: H01L2900
- IPC: H01L2900

Abstract:
A semiconductor inductor and a method for making a semiconductor inductor are provided. An oxide layer disposed over a substrate is etched to form an interconnect metallization trench within the oxide layer. The oxide layer is also etched to form a first inductor trench within the oxide layer such that the first inductor trench is defined in an inductor geometry. The oxide layer is then etched to form at least one via in the interconnect metallization trench and a second inductor trench over the first inductor trench in the oxide layer. The second inductor trench also has the inductor geometry. After the oxide layer is etched, the at least one via, the second inductor trench, the interconnect metallization trench and the first inductor trench are filled with copper. The semiconductor inductor is configured to have a low resistance and a high quality factor.
Public/Granted literature
- US20030170989A1 Semiconductor inductor and methods for making the same Public/Granted day:2003-09-11
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